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设想取造程才能
Item 2017 2018 2019
Muti-layer
Muti-layer
8 10 10
Inner Layer Registration
0.075mm 0.05mm 0.05mm
Thickness         Rigid-Flex               0.25~2.0mm 0.25~2.0mm 0.25~2.0mm
FPC                              0.05~0.5mm 0.05~0.5mm 0.05~0.5mm
Min. Trace Width/Space
S/S &D/S Trace width/space
45/45μm 35/35μm 30/30μm
Annular Ring
0.075mm 0.05mm 0.05mm
Impedance control
0.1 0.08 0.08
Drilling
Drilled through-hole via diameter:Mechanical Drill
0.1mm 0.1mm  0.1mm 
CVL
CVL Registration
0.1mm 0.05mm 0.05mm
LPI
LPI Opening
0.20mm 0.20mm 0.20mm
Solder dam
0.1mm 0.1mm 0.1mm
LPI Registration
50μm 30μm 30μm
Printing 
Printing shift
0.200mm 0.150mm 0.150mm
Item 2017 2018 2019
SMT
Connector pitch
0.350mm 0.300mm 0.300mm
Smallest Component

01005

01005

01005
Stiffener
Stiffener Registration
0.200mm 0.100mm 0.100mm
Punch
The tolerance With Two Time Punch
Min ±0.1 Min ±0.1 Min ±0.1
 Finger Outline                0.05mm 0.05mm 0.05mm
Finger Skewing              0.07mm 0.05mm 0.05mm
Scoop Molding     Scoop Molding Tolerance    0.075mm 0.075mm 0.075mm
 E.T.
4-Wire
Y Y Y

Surface Treatment
Ni-Au Plating  Ni:1.25~3.75um     Range 2.5
       3.75~10um      Range 3.75  
  Au:0.025~0.125um   Range 0.075
Thick Au-plating
  Au:0.15~0.25um     Range 0.125
   0.25~0.75um     Range 0.2
Immersion Au-Plating
                 Ni:1.25~6.25um     Range 2 
 Au:0.025~0.1um     Range 0.075
ENEPIG
Ni:>3um
Pd:>0.1um
Au:>0.05um
OSP 0.2~0.5um
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